Breaking Moore’s law
just slightly changing packages!

Get out of district 9

Now

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3D Ics … Fin FET

Why not?!

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21st century was not started yet.

  • 3D cooling is the foundation for 5G

  • metro size super BBUs

  • metro wise interference coordination

  • 6G

  • AI GPGPUS

  • Super computimgs

  • tightly coupled cloud servers

  • this is the very the 1st step for 3D cooling, just through minor package modification, without any fundamental engineering.

Regular intel package

FC-BGA1.png

FC BGA

Regular intel package

FC-BGA2.png

today

New invented FC-BGA package

New invented FC-BGA package.png

Just package change, with 10 layers, 100 times faster.

  • Shorter interconnect, inter layer connections

  • Tightly coupled

  • Maisonette type is recommended

  • No change, just packaging and signaling, all minor issue

  • Infinite power today

  • Suit for GPGPU, cloud servers, super BBUs, supercomputers

  • You can do it today just calling to package vendor

Xeon interconnect

Xeon1.png

Slow

Crowded

Faraway,

Occupy spaces

Limited

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Xeon2.png

Moore’s law is valid only for the  strict 9.

GPGPU PCI express array

GPGPU PCI express array.png
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Maisonette type is recommended

Maisonette.png
  • lElevator stops every 2 floor

  • lCPU, local memory CPU, local memory

  • lTo access global memory(HBM), need to use common elevator

  • lTo access outer, first layer connects to the mother boards

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Box unit construction(Photo from www.sekisuiheim.com)

Maisonette type1.png
Maisonette type2.png
General diagram of maisonette type.png
図45.png
図18.png