Breaking Moore’s law
just slightly changing packages!
Get out of district 9
Now
3D Ics … Fin FET
Why not?!
21st century was not started yet.
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3D cooling is the foundation for 5G
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metro size super BBUs
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metro wise interference coordination
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6G
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AI GPGPUS
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Super computimgs
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tightly coupled cloud servers
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this is the very the 1st step for 3D cooling, just through minor package modification, without any fundamental engineering.
Regular intel package
FC BGA
Regular intel package
today
New invented FC-BGA package
Just package change, with 10 layers, 100 times faster.
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Shorter interconnect, inter layer connections
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Tightly coupled
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Maisonette type is recommended
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No change, just packaging and signaling, all minor issue
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Infinite power today
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Suit for GPGPU, cloud servers, super BBUs, supercomputers
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You can do it today just calling to package vendor
Xeon interconnect
Slow
Crowded
Faraway,
Occupy spaces
Limited
…
Moore’s law is valid only for the strict 9.
GPGPU PCI express array
Maisonette type is recommended
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lElevator stops every 2 floor
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lCPU, local memory CPU, local memory
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lTo access global memory(HBM), need to use common elevator
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lTo access outer, first layer connects to the mother boards
Box unit construction(Photo from www.sekisuiheim.com)
